Smart probe

ABSTRACT

The present system, method, article of manufacture, software, and apparatus is an “intelligent” probe system and components thereof and may openly encompass, in at least an embodiment, an embedded IC chip located in an interchangeable probe(s) which offers repeatable, fast, easy, and error free probe swapping on a CMM.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Nonprovisional application Ser.No. 12/813,787 filed on Jun. 11, 2010, which claims the benefit ofNon-Provisional application Ser. No. 11/848,266, filed on Aug. 31, 2007(now U.S. Pat. No. 7,735,234 issued on Jun. 15, 2010), and U.S.Provisional Application Ser. No. 60/841,648, filed Aug. 31, 2006, thedisclosures of all of which are incorporated herein by reference intheir entirety.

FIELD OF INVENTION

The present invention relates in general to measurement devices andmethods including, but not limited to, coordinate measurement machines(CMM's).

BACKGROUND

Coordinate measurement machines (CMM's) measure parts, typically duringmanufacture, by probing the part to be measured with a probe such as aprobe tip either by physical contact of the probe tip to the part, or bynon-contact means. Angular encoders or other means may be located in thejoints of the CMM robotic arm segments which hold the probe tip, andthus the position of the probe tip may be measured in a convenientcoordinate system of the user's choosing. The operations of the CMM canalso be coordinated with a CAD system or software for example.

Different probes or end effectors are used for different applications.For example, some areas of an object to be measured are difficult toreach and thus require specifically sized or shaped probes to be used onthe CMM. Therefore, probes are commonly interchanged depending upon thecharacteristics of the region to be measured.

However, calibration is often a time consuming issue when using CMM's,especially when differently sized probes are interchanged andrecalibration is typically required. In an assembly line environment forexample, taking a CMM off-line for twenty minutes so that it can berecalibrated when a probe tip is changed can cause problems. Thus,manufacturers endeavor to set up their CMM's so that interchangeabilityof probes may be accurately performed with a minimum of downtime due torecalibration. However, further innovations are necessary.

Applicants' company, FARO Technologies, Inc., has several patentsrelated to CMM's or related areas, including: U.S. Pat. Nos. 5,611,147,5,794,356, 6,612,044, 6,820,346, 6,796,048, 6,920,697, 6,965,843, theentire disclosures of which are hereby incorporated herein by reference.

An example of a current system in use is the Romer Simcor “Infinite”series that uses a specific pin system associated with each specificinterchangeable probe. In this system, a set of specific probes can beinterchanged and identified by the CMM using a physical and/orelectrical pin orientation which is unique to each probe and which mustbe entered and stored into a memory located in the CMM for example forlater recognition. Thus, the number of probes that are useable islimited by the possible pin orientations. Also, probes of the samesize/type cannot be distinguished. Additionally, a manual initial set-upand entry to a memory in the CMM for example is needed to record thedimensions and characteristics of each specific end effector in auseable database. Thus, the system is limited in scope of application,and it is not a fully automatic recognition system or a readily, easily,or infinitely expandable system. It is also not dynamically configurableor configurable on the fly during measurement. For example, if aparticular algorithm or particular data is used with the probe, sincethe Romer probe does not have a processor or a memory, the algorithms ordata used with the probe could not be easily updated in the probeitself.

SUMMARY

The present system, method, article of manufacture, and apparatus is an“intelligent” probe system and may comprise, in at least an embodiment,an embedded IC chip located in an interchangeable probe(s) which offersrepeatable, fast, easy, and error free probe swapping on a CMM.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will now be described, by way of example only, withreference to the accompanying drawings which are meant to be exemplary,not limiting, and wherein like elements are numbered alike in severalFigures, in which:

FIG. 1 is a front perspective view of a CMM with an articulated arm andan attached computer;

FIG. 2 is rear perspective view of an interchangeable probe with anembedded integrated circuit;

FIG. 3 is front perspective view of an attachment point for theinterchangeable probe on the CMM;

FIG. 4 is a top view of a concentric ring commutator of the secondembodiment;

FIG. 5 is a bottom view of a concentric ring commutator of the secondembodiment;

FIG. 6 is a perspective view of a connector having a concentric ringcommutator of the second embodiment;

FIG. 7 is an exploded view of a probe body with a connector having aconcentric ring commutator of the second embodiment;

FIG. 8 is an exploded view of a probe body with a connector having aconcentric ring commutator of the second embodiment;

FIG. 9 is a sectional view of a probe body with a connector having aconcentric ring commutator of the second embodiment;

FIG. 10 is a sectional view of a probe body with a connector having aconcentric ring commutator of the second embodiment;

FIG. 11 is a sectional view of a probe body with a connector having aconcentric ring commutator of the second embodiment.

FIG. 12 is a perspective view of a probe body with a wireless connectorof a third embodiment.

FIG. 13 is a sectional view of a CMM arm with a wireless connector of athird embodiment.

FIG. 14 shows a screen shot of one embodiment of software that may beassociated with the present system

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

A CMM 30 is generally shown in FIG. 1.

With reference to FIGS. 2-3, a first embodiment of the present system isan “intelligent” probe system comprising an embedded IC chip 15 locatedin an interchangeable probe(s) 10 which offers repeatable, fast, easy,and error free probe swapping on the CMM 30 as each probe 10 is“electronically serialized” with the embedded IC chip 15 and anelectronic serial number. The IC chip 15 also contains a memory bufferthat stores the probe's attributes, information specific to thecharacteristics of the probe, and calibration data specific to a CMM.

As shown in FIG. 10, it is also possible for the IC chip 15 to belocated in an adapter probe body 10 which would be attached between astandard “dumb” probe tip 10 a and a CMM arm 20. Therefore, the specificlocation of the IC chip is not limited and may be placed anywhere in thepresent invention.

Referring to the first embodiment shown in FIG. 2, when attached ontothe CMM arm 20, the embedded IC chip 15 not only identifies the size andtype of probe 10, but it ties a specific set of calibration data to acombination of probe 10 and CMM arm 20 for example. Thus, the same probe10 may be used on multiple CMM arms 20, and each calibration set will beunique for a particular serial numbered probe/arm combination thusensuring maximum accuracy.

Calibration data may be created via a probe calibration at any time.This new data will be saved on and will remain with the CMM arm 20, orbe saved in a memory in the IC chip 15 on the probe 10 depending uponthe application. Each arm can retain data for multiple probes, or allthe necessary data can be stored in the probe if desired.

Calibration data and probe data or information to be transferred fromfor example an EEPROM IC CHIP 15 (located somewhere in the probe orremotely) to make the system “smart,” may include, but is not limitedto, tip diameter, coefficient of thermal expansion (CTE), probe type(for example hard probe or mechanical touch probe or other type), balldiameter, and “x, y, z, offsets” and/or six degrees of freedom for theprobe either by itself and/or when it is connected to a particular CMMand may be dependent upon the individual configuration and programming.This can all be indexed to a serial number for example and/or any dataformat may be used. Thus, when the smart probe 10 is connected to theCMM arm 20 all of the necessary calibration and probe data isautomatically transferred. FIG. 14 shows a screen shot of one embodimentof software associated with the present system wherein the probe'sserial number is read and then indicates the tip diameter to be 6 mm,and the temperature coefficient of thermal expansion (CTE) to be 1.0e-009 for example. However, any relevant data fields may be configuredto be read based on the user's preferences and the configurations andthus the invention is not limited to the configuration shown in thisscreen shot.

Additionally, a calibration ball, a hole, or artifact may be measured bythe system to perform an arm calibration or other calibration as welland these calibration methods are well known in robotics and thus notdiscussed further herein.

Probes 10 may take many additional and different shapes and forms asneeded (not shown). However, using the present “smart probe” system, theprobes 10 may be changed at any time without performing another probecalibration. Specifically, upon mating with electrical connectionsection 40 having any desired orientation of electrical contacts 60, theprobe 10 serial number will automatically be detected and propercalibration data will be called by the system computer 50 or othersuitable means, and used by CAM Measure software for example foroperation of the CMM 30. No menu selection of probes will be required solong as electronically serialized probes are used. Thus, the probe isautomatically recognized or installed and the CMM arm 20 and probe 10combination is automatically calibrated in a “plug and play” fashion asthe system uses the serial number to reference calibration data specificto the probe and correlates that to the operational kinematics.

Many different connection structures are encompassed by and will besuitable for use with the present invention. Thus, the possible types ofconnectors or connection structures are not limited in any way by thebelow description of embodiments.

For example in the first embodiment, shown in FIGS. 2 and 3, a threeball 70 kinematic mount connection structure with pin 80 is shown. Inthis embodiment, pin 80 is slid into hole 81 to align the electricalcontacts 60 and then a rotatable threaded ring 85 is screwed down tohold the probe 10 onto electrical connection section 40 of the CMM arm20.

It is important to note that in FIG. 2, IC chip 15 is shown within probebody 10 a simply for convenience. However, often times probe tip 10 amay be a “dumb” probe tip supplied by any “dumb” probe tip manufacturer.The dumb probe tip 10 a is then simply connected to a probe 10 thatwould contain a programmable IC chip 15 (not shown) is this case. The ICchip would have to be initially programmed with the properties anddimensions of the dumb probe body 10 a, but after this is done, a smartprobe 10 (with the dumb probe body attached) has been effectivelycreated. Thus, probe 10 is more like an “adapter” in this case becauseany dumb probe made by anyone can be attached to probe 10. FIG. 10 showsthis very clearly in one embodiment wherein “smart” probe 10 accepts thethreaded dumb probe tip 10 a.

As shown in FIGS. 4-9, a second embodiment connection structure isshown. In this embodiment, a “screw on” probe is used to make theelectrical connection between electrical contacts and a concentric ringcommutator 100. Thus, the probe 10 is simply screwed onto the CMM arm20. This version also has four electrical contacts.

Additionally, the probe 10 may be “dynamically configurable” so that anystored programs, calibrations, software, data, algorithms or otherinformation can be easily updated or changed. For example, if particulardata is used with the probe, since probe 10 has embedded IC chip 15 witha memory capability for example, the data used with the probe may beeasily updated in the probe. Alternatively, the updated data could bepresent in the computer 50 or other means in the CMM 30 and then probe10 and IC chip 15 could be updated when it is connected to the CMM arm20. This offers an enormous time savings and flexibility over the “dumbprobes” of the prior art.

Also, if a serialized probe 10 is attached to a CMM arm 20 where noprior calibration data has been collected, the user will be required toperform a probe calibration. The data will be saved in any desiredlocation including in the probe 10 for example, and the probecalibration for this arm/probe combination will not be required again.

If standard (non serialized) probes are to be used on the CMM arm, aconnector cover could be installed and manual menu selection of theprobe size will be required.

Thus, by using the present system, an operator may quickly change theprobe 10 size and shape to obtain optimal accuracy for differentfeatures. Without the present system, whenever a probe 10 is changed,the CMM and/or probe must be recalibrated. Thus, with the presentsystem, probes may be changed at any time without performing anotherprobe calibration.

Since calibration data is specific to an arm-probe combination, the sameprobe may be used on multiple arms. Each calibration data set will beunique for a particular serial numbered probe/arm combination thusensuring maximum accuracy.

Calibration data may be created via a probe calibration at any time.This new data may be saved on and will remain with the arm, or withinthe probe itself.

Of course, if the operator doubts that a newly connected probe iscalibrated correctly, a probe calibration may be performed as anadditional step. However, because the present smart probe systemincludes IC chip 15, any probe calibration will be simplified becauseknown or fixed variables such as the probe tip diameter, and the probelength will already be fixed and known and thus these variables will nothave to be computed or measured in the probe calibration.

Each CMM arm 20 may also retain data for any probe that has beencalibrated on it and which may be viewed or updated on display terminal50. A database (not shown) may also be present in the CMM 20 or may belocated in remote location and may be accessible by wireless or othermeans.

Essentially, any type of probe can be manufactured with the presentsystem feature. Renishaw™ probes using contact switch technology areobvious types of alternate configurations that will benefit from thetechnology. Specific contact directions that affect the probeperformance can be stored inside the IC, thus improving accuracy andperformance of the system.

The present system may also be used with and to improve the systemsdisclosed in U.S. Pat. Nos. 6,931,745, 5,829,148 and 6,920,697 and manyother CMM's and measurement systems for example.

The system may also periodically interrogate the probe 10 for presenceto ensure it has not been removed or changed and thereby maintainintegrity of the system and each measurement.

Software may configure the operation of the CMM arm 20 to use a probewithout the present smart probe 10 system. However, the probe must becalibrated before use and there is no way for the system to detect whena probe has been changed, which is common source of error. In contrast,software can automatically configure the operation of the applicationwhenever the present smart probe 10 is attached.

The probe 10 may be mounted on the CMM 30 or other measurement device bythe means of a kinematic mount. The kinematic mount ensures that theprobe is installed exactly the way it was during initial calibration.The kinematic mount may comprise three equally spaced balls mounted onthe measurement device and three tapered slots in the probe 10. A pin 80is used to ensure that the three balls 70 always return to the sameslots they were in during initial calibration.

Intelligent Probes and Probe Types

Additionally, the scope of a smart probe 10 is expanded to include theprovision of more sophisticated probes. The intelligence embedded in theend effector will include parametrics for not only the probe type andattributes, it includes the ability to store attribute data forarticulators. Use with different systems, is a learning process thatonce used, will not have to be taught the information again. Thus, theprobe 10, is a true “plug and play” type of probe.

Furthermore, the probe itself is not limited to hard contact effectors,but active and dynamic sensors, and the complexity of multiple sensors.For instance a temperature sensor could be easily embedded into thecontactor to measure artifact temperature and render isotherm profiles.The same temperature sensor probe could easily identify to the system,when a surface is contacted and report the point at contact. Othersensor types are conceived as physical transducers for pressure,resistive, capacitive, optical, magnetic, electromagnetic, radio andsonic sensing means.

For example, a part temperature measurement system may be added to theCMM arm. This could be an I/R, non-contact temperature measurementsystem built into the end of the arm or into a probe or otherarrangement, or a fast response temperature sensor in the probe tip thatcould measure a part temperature with a few milliseconds of touching thepart. In both cases, it is envisioned to collect temperature data, notonly of the part, but of the section of the part being measured. Thistemperature data would be linked to the measurement data in real timefor later analysis with the intent of generating a temperature profileof the part in CAD, and/or providing data for temperature compensationof the measurement data. As an example, large equipment companiessometimes measure parts (like an airplane wing) that are part in sun andpart in shade. Also, large parts may take a long time to measure, thus aset of data may be taken over several hours as temperatures change. Bycollecting temperature data automatically with each measurement, for thepoint on the part measured, a temperature profile could be constructedand used to compensate measurements. Thus, the temperature measurementdevice may be integrated into the arm, and collects both temperaturedata and measurement data simultaneously. Currently, if part temperatureis measured, it is usually done with a separate piece of equipment at asingle point in time.

As shown in the third embodiment shown in FIGS. 12 and 13, wirelesstechnologies shown by “W” in the figures, may also be used between anyof the parts of the CMM, such as between the probe tip 10 a, probe body20, and the CMM 20 or between the CMM and a laptop computer or anywherethat wires are desired to be eliminated. Some of the common wirelessstandards are discussed below, however any appropriate wireless standardor radio frequency may be used.

For example, RFID may be a possible wireless “smart probe”implementation. Radio-frequency identification (RFID) is an automaticidentification method, relying on storing and remotely retrieving datausing devices called RFID tags or transponders. An RFID tag is an objectthat can be stuck on or incorporated into a product, animal, or personfor the purpose of identification using radiowaves. Some tags can beread from several meters away and beyond the line of sight of thereader.

Most RFID tags contain at least two parts. One is an integrated circuitfor storing and processing information, modulating and demodulating a(RF) signal and can also be used for other specialized functions. Thesecond is an antenna for receiving and transmitting the signal. Atechnology called chipless RFID allows for discrete identification oftags without an integrated circuit, thereby allowing tags to be printeddirectly onto assets at lower cost than traditional tags. This systemmay easily be substituted into the present invention.

Some of the common wireless standards are discussed below, however anyappropriate wireless standard or radio frequency may be used.

IEEE 802.11. (WLAN)

802.11 refers to a family of specifications developed by the IEEE forwireless LAN technology

802.11 specifies an over-the-air interface between a wireless client anda base station or between two wireless clients.

The IEEE accepted the specification in 1997.

There are several specifications in the 802.11 family:

802.11—applies to wireless LANs and provides 1 or 2 Mbps transmission inthe 2.4 GHz band using either frequency hopping spread spectrum (FHSS)or direct sequence spread spectrum (DSSS).

802.11a—an extension to 802.11 that applies to wireless LANs andprovides up to 54 Mbps in the 5 GHz band. 802.11a uses an orthogonalfrequency division multiplexing encoding scheme rather than FHSS orDSSS.

802.11b (also referred to as 802.11 High Rate or Wi-Fi—an extension to802.11 that applies to wireless LANS and provides 11 Mbps transmission(with a fallback to 5.5, 2 and 1 Mbps) in the 2.4 GHz band. 802.11b usesonly DSSS. 802.11b was a 1999 ratification to the original 802.11standard, allowing wireless functionality comparable to Ethernet.

802.11g—applies to wireless LANs and provides 54 Mbps in the 2.4 GHzband. 802.11g specification employs orthogonal frequency divisionmultiplexing (OFDM), the modulation scheme used in 802.11a to obtainhigher data speed. Computers or terminals set up for 802.11g can fallback to speeds of 11 Mbps. This feature makes 802.11b and 802.11gdevices compatible within a single network.

Note: there are other alpha designations such as e, f, h, i, j, k, m andn which are used to denote refinements such as security,interoperability, interference resolution and documentation.

802.11g is the most widely and commonly available technology.

IEEE 802.15 (WPAN)

802.15 is a communications specification that was approved in early 2002by the Institute of Electrical and Electronics Engineers StandardsAssociation (IEEE-SA) for wireless personal area networks (WPANs).

The IEEE 802.15 Working Group proposed two general categories of 802.15,called TG4 (low rate) and TG3 (high rate). The TG4 version provides dataspeeds of 20 Kbps or 250 Kbps. The TG3 version supports data speedsranging from 1.1 Mbps to 55 Mbps.

802.15.4 (ZigBee) falls into the TG4 group while Bluetooth the TG3.ZigBee plays a major role for remote sensors.

802.15.1 Bluetooth

Bluetooth is a short-range, radio-based wireless technology used toeliminate cables.

Whereas 802.11 (Wi-Fi) is a connectivity solution designed to eliminateEthernet wiring within a home or office, Bluetooth is a solutiondesigned to eliminate USB and parallel printer cables. It alsoeliminates other short wired connections, such as cables that link aheadset, keyboard or mouse to a PDA or cellular phone.

Bluetooth-enabled products communicate via “ad hoc” short range networksknown as piconets. Piconets are established dynamically as Bluetoothdevices come within range of each other.

Note: A unique Bluetooth Device Address (BD_ADDR) is required for everydevice. The IEEE assigns one part, the Organizationally UniqueIdentifier (OUI), and the manufacturer the Extension Identifier (EI)part. Each is 24 bits in length. The 24-bit EI gives the manufacture 16million BD_ADDRs per OUI block.

Bluetooth raw data rates are:

Version 1.1=1 Mbps

Version 2.0+ EDR (Extended Data Rate) 3 Mbps

Bluetooth Range:

Class 3 (1 mW)—1 m (3 feet) minimum.

Class 2 (2.5 mW)—10 m (30 feet) minimum

Class 1 (100 mW)—100 m (300 feet) minimum.

A good choice for at least an embodiment of this invention may be to usea combination of 802.11b/g and Bluetooth.

A present implementation of the probe interface allows for a zero-voltreference (power common), programmable power supply with digital andlinear feedback, and a serial data path. The serial data is used for thesmart probe communication; while the power pin is implemented to providefeedback for the Renishaw™ probe switch. The power pin can be used tosupply energy to other active probes as necessary as referenced above.

One of ordinary skill in the art can appreciate that a computer or otherclient or server device can be deployed as part of a computer network,or in a distributed computing environment. In this regard, the methodsand apparatus described above and/or claimed herein pertain to anycomputer system having any number of memory or storage units, and anynumber of applications and processes occurring across any number ofstorage units or volumes, which may be used in connection with themethods and apparatus described above and/or claimed herein. Thus, thesame may apply to an environment with server computers and clientcomputers deployed in a network environment or distributed computingenvironment, having remote or local storage. The methods and apparatusdescribed above and/or claimed herein may also be applied to standalonecomputing devices, having programming language functionality,interpretation and execution capabilities for generating, receiving andtransmitting information in connection with remote or local services.

The methods and apparatus described above and/or claimed herein isoperational with numerous other general purpose or special purposecomputing system environments or configurations. Examples of well knowncomputing systems, environments, and/or configurations that may besuitable for use with the methods and apparatus described above and/orclaimed herein include, but are not limited to, personal computers,server computers, hand-held or laptop devices, multiprocessor systems,microprocessor-based systems, network PCs, minicomputers, mainframecomputers, distributed computing environments that include any of theabove systems or devices.

The methods described above and/or claimed herein may be described inthe general context of computer-executable instructions, such as programmodules, being executed by a computer. Program modules typically includeroutines, programs, objects, components, data structures, etc. thatperform particular tasks or implement particular abstract data types.Thus, the methods and apparatus described above and/or claimed hereinmay also be practiced in distributed computing environments such asbetween different power plants or different power generator units wheretasks are performed by remote processing devices that are linked througha communications network or other data transmission medium. In a typicaldistributed computing environment, program modules and routines or datamay be located in both local and remote computer storage media includingmemory storage devices. Distributed computing facilitates sharing ofcomputer resources and services by direct exchange between computingdevices and systems. These resources and services may include theexchange of information, cache storage, and disk storage for files.Distributed computing takes advantage of network connectivity, allowingclients to leverage their collective power to benefit the entireenterprise. In this regard, a variety of devices may have applications,objects or resources that may utilize the methods and apparatusdescribed above and/or claimed herein.

Computer programs implementing the method described above will commonlybe distributed to users on a distribution medium such as a CD-ROM. Theprogram could be copied to a hard disk or a similar intermediate storagemedium. When the programs are to be run, they will be loaded either fromtheir distribution medium or their intermediate storage medium into theexecution memory of the computer, thus configuring a computer to act inaccordance with the methods and apparatus described above.

The term “computer-readable medium” encompasses all distribution andstorage media, memory of a computer, and any other medium or devicecapable of storing for reading by a computer a computer programimplementing the method described above.

Thus, the various techniques described herein may be implemented inconnection with hardware or software or, where appropriate, with acombination of both. Thus, the methods and apparatus described aboveand/or claimed herein, or certain aspects or portions thereof, may takethe form of program code or instructions embodied in tangible media,such as floppy diskettes, CD-ROMs, hard drives, or any othermachine-readable storage medium, wherein, when the program code isloaded into and executed by a machine, such as a computer, the machinebecomes an apparatus for practicing the methods and apparatus ofdescribed above and/or claimed herein. In the case of program codeexecution on programmable computers, the computing device will generallyinclude a processor, a storage medium readable by the processor, whichmay include volatile and non-volatile memory and/or storage elements, atleast one input device, and at least one output device. One or moreprograms that may utilize the techniques of the methods and apparatusdescribed above and/or claimed herein, e.g., through the use of a dataprocessing, may be implemented in a high level procedural or objectoriented programming language to communicate with a computer system.However, the program(s) can be implemented in assembly or machinelanguage, if desired. In any case, the language may be a compiled orinterpreted language, and combined with hardware implementations.

The methods and apparatus of described above and/or claimed herein mayalso be practiced via communications embodied in the form of programcode that is transmitted over some transmission medium, such as overelectrical wiring or cabling, through fiber optics, or via any otherform of transmission, wherein, when the program code is received andloaded into and executed by a machine, such as an EPROM, a gate array, aprogrammable logic device (PLD), a client computer, or a receivingmachine having the signal processing capabilities as described inexemplary embodiments above becomes an apparatus for practicing themethod described above and/or claimed herein. When implemented on ageneral-purpose processor, the program code combines with the processorto provide a unique apparatus that operates to invoke the functionalityof the methods and apparatus of described above and/or claimed herein.Further, any storage techniques used in connection with the methods andapparatus described above and/or claimed herein may invariably be acombination of hardware and software.

While preferred embodiments have been shown and described, variousmodifications and substitutions may be made thereto without departingfrom the spirit and scope of the invention. Accordingly, it is to beunderstood that the present invention has been described by way ofillustrations and not limitation.

This written description uses examples to disclose the invention,including the best mode, and also to enable any person skilled in theart to make and use the invention. The patentable scope of the inventionis defined by the claims, and may include other examples of devices,methods, and articles of manufacture that occur to those skilled in theart. Such other examples are intended at least to be within the scope ofthe claims if they have structural elements that do not differ from theliteral language of the claims, or if they include equivalent structuralelements with insubstantial differences from the literal languages ofthe claims and/or as allowed by law.

Furthermore, the skilled artisan will recognize the interchangeabilityof various features from different embodiments. Similarly, the variousfeatures described, as well as other known equivalents for each feature,can be mixed and matched by one of ordinary skill in this art.

While the preferred embodiments of the present invention have beendescribed using specific terms, such description is for illustrativepurposes only, and it is to be understood that changes and variationsmay be made without departing from the spirit or scope of the appendedclaims. The presently disclosed embodiments are therefore to beconsidered in all respects as illustrative and not restrictive, and allchanges which come within the meaning and range of equivalency of theclaims are therefore intended to be embraced therein.

What is claimed is:
 1. A method for creating a plurality of smart probesfor an articulated arm coordinate measurement machine, the methodcomprising: providing an articulated arm coordinate measurement machine,a smart adapter, a first dumb probe, and a second dumb probe, the smartadapter including an adapter probe body, an integrated circuit, amemory, and an electrical connector, the first dumb probe and the seconddumb probe configured to couple to the smart adapter, the smart adapterconfigured to couple to the articulated arm coordinate measurementmachine; attaching the smart adapter to the articulated arm coordinatemeasurement machine; storing properties and dimensions of the first dumbprobe in the memory; storing properties and dimensions of the seconddumb probe in the memory; attaching the first dumb probe to the smartadapter; measuring three-dimensional coordinates of a first point inspace with the first dumb probe based at least in part on the storedproperties and dimensions of the first dumb probe; removing the firstdumb probe from the smart adapter and attaching the second dumb probe tothe smart adapter; measuring three-dimensional coordinates of a secondpoint in space with the second dumb probe based at least in part on thestored properties and dimensions of the second dumb probe; removing thesecond dumb probe from the smart adapter and attaching the first dumbprobe to the smart adapter; and measuring three-dimensional coordinatesof a third point in space with the first dumb probe based at least inpart on the stored properties and dimensions of the first dumb probe. 2.The method of claim 1 wherein, in the step of providing an integratedcircuit and a memory, the memory is included within the integratedcircuit.
 3. A method for creating a plurality of smart sensing probesfor an articulated arm coordinate measurement machine, the methodcomprising: providing an articulated arm coordinate measurement machine,a smart adapter, a first sensing probe, and a second sensing probe, thesmart adapter including an adapter probe body, an integrated circuit, amemory, and an electrical connector, the first sensing probe including afirst sensor, the second sensing probe including a second sensor, thefirst sensor probe and the second sensor probe configured to couple tothe smart adapter, the smart adapter configured to couple to thearticulated arm coordinate measurement machine; attaching the smartadapter to the articulated arm coordinate measurement machine; storingproperties and dimensions of the first sensor probe in the memory;storing properties and dimensions of the second sensor probe in thememory; attaching the first sensor probe to the smart adapter; measuringwith the first sensing probe three-dimensional coordinates of a firstpoint and a corresponding first sensed quantity, the three-dimensionalcoordinates of the first point based at least in part on the storedproperties and dimensions of the first sensing probe, the first sensedquantity based at least in part on a first signal from the first sensor;removing the first sensing probe from the smart adapter and attachingthe second sensing probe to the smart adapter; measuring with the secondsensing probe three-dimensional coordinates of a second point and acorresponding second sensed quantity, the three-dimensional coordinatesof the second point based at least in part on the stored properties anddimensions of the second sensing probe, the second sensed quantity basedat least in part on a second signal from the second sensor; removing thesecond sensing probe from the smart adapter and attaching the firstsensing probe to the smart adapter; and measuring with the first sensingprobe three-dimensional coordinates of a third point and a correspondingthird sensed quantity, the three-dimensional coordinates of the thirdpoint based at least in part on the stored properties and dimensions ofthe first sensing probe, the third sensed quantity based at least inpart on a third signal from the first sensor.
 4. The method of claim 3wherein, in the step of providing an integrated circuit and a memory,the memory is included within the integrated circuit.
 5. The method ofclaim 3 wherein, in the step of providing a first sensor, the firstsensor is selected from the group consisting of a temperature sensor, apressure sensor, a resistive sensor, a capacitive sensor, an opticalsensor, a magnetic sensor, an electromagnetic sensor, a radio sensor,and a sonic sensor.